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What is a multi-layer circuit board, and what are the advantages of a multi-layer PCB circuit board? As the name suggests, a multi-layer circuit board means that a circuit board with more than two layers can be called a multi-layer. I have analyzed what a double-sided circuit board is before, and a multi-layer circuit board is more than two layers, such as four layers, six layers, Eighth floor and so on. Of course, some designs are three-layer or five-layer circuits, also called multi-layer PCB circuit boards. Larger than the conductive wiring diagram of the two-layer board, the layers are separated by insulating substrates. After each layer of circuits is printed, each layer of circuits is overlapped by pressing. After that, drilling holes are used to realize the conduction between the lines of each layer.
The advantage of multi-layer PCB circuit boards is that the lines can be distributed in multiple layers, so that more precise products can be designed. Or smaller products can be realized by multi-layer boards. Such as: mobile phone circuit boards, micro projectors, voice recorders and other relatively bulky products. In addition, multiple layers can increase the flexibility of design, better control of differential impedance and single-ended impedance, and better output of some signal frequencies.
Multilayer circuit boards are an inevitable product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits, multilayer printed circuits are rapidly developing in the direction of high density, high precision, and high-level numbers. , Blind hole buried hole high plate thickness aperture ratio and other technologies to meet the needs of the market.
Due to the need for high-speed circuits in the computer and aerospace industries. It is required to further increase the packaging density, coupled with the reduction of the size of the separated components and the rapid development of microelectronics, the electronic equipment is developing in the direction of reducing the size and quality; due to the limitation of the available space, it is impossible for the single-sided and double-sided printed boards A further increase in assembly density is achieved. Therefore, it is necessary to consider using more printed circuits than double-sided layers. This creates conditions for the emergence of multilayer circuit boards.