Notice on holding “Component Failure Analysis Technology and Practice Case” Application analysis Senior Seminar
The fifth Institute of Electronics, Ministry of Industry and Information Technology
Enterprises and institutions:
In order to help engineers and technicians master the technical difficulties and solutions of component failure analysis and PCB&PCBA failure analysis in the shortest time; Help relevant personnel in the enterprise to systematically understand and improve the relevant technical level to ensure the validity and credibility of the test results. The Fifth Institute of Electronics of the Ministry of Industry and Information Technology (MIIT) was held simultaneously online and offline in November 2020 respectively:
1. Online and offline synchronization of “Component Failure Analysis Technology and Practical Cases” Application analysis Senior workshop.
2. Held the electronic components PCB&PCBA reliability failure analysis technology practice case analysis of online and offline synchronization.
3. Online and offline synchronization of environmental reliability experiment and reliability index verification and in-depth analysis of electronic product failure.
4. We can design courses and arrange internal training for enterprises.
Training Contents:
1. Introduction to failure analysis;
2. Failure analysis technology of electronic components;
2.1 Basic procedures for failure analysis
2.2 Basic path of non-destructive analysis
2.3 Basic path of semi-destructive analysis
2.4 Basic path of destructive analysis
2.5 The whole process of failure analysis case analysis
2.6 Failure physics technology shall be applied in products from FA to PPA and CA
3. Common failure analysis equipment and functions;
4. Main failure modes and inherent failure mechanism of electronic components;
5. Failure analysis of major electronic components, classic cases of material defects (chip defects, crystal defects, chip passivation layer defects, bonding defects, process defects, chip bonding defects, imported RF devices – thermal structure defects, special defects, inherent structure, internal structure defects, material defects; Resistance, capacitance, inductance, diode, triode, MOS, IC, SCR, circuit module, etc.)
6. Application of failure physics technology in product design
6.1 Failure cases caused by improper circuit design
6.2 Failure cases caused by improper long-term transmission protection
6.3 Failure cases caused by improper use of components
6.4 Failure cases caused by compatibility defects of assembly structure and materials
6.5 Failure cases of environmental adaptability and mission profile design defects
6.6 Failure cases caused by improper matching
6.7 Failure cases caused by improper tolerance design
6.8 Inherent mechanism and inherent weakness of protection
6.9 Failure caused by component parameter distribution
6.10 FAILURE cases caused by PCB design defects
6.11 Failure cases caused by design defects can be manufactured
Post time: Dec-03-2020