Main Products
Metal PCB
FPC
FR4+Embedded
PCBA
Application Area
Application Cases of Company Products
Application in headlight of NIO ES8
Application in headlight of ZEEKR 001
The matrix headlight module of ZEEKR 001 uses a single-sided copper substrate PCB with thermal vias technology, produced by our company, which is achieved by drilling blind vias with depth control then plating through-hole copper to make the top circuit layer and the bottom copper substrate conductive, thus realizing heat conduction. Its heat dissipation performance is superior to that of a normal single-sided board, and at the same time solves the heat dissipation problems of LEDs and ICs, enhancing the service life of the headlight.
Application in ADB headlight of Aston Martin
The one-sided double-layer aluminum substrate produced by our company is used in ADB headlight of Aston Martin. Compared to the ordinary headlight, the ADB headlight is more intelligent, so PCB have more components and complex wiring. The process feature of this substrate is to use double-layer to solve the heat dissipation problem of the components at the same time. Our company uses a heat-conductive structure with a heat dissipation rate of 8W/M.K in two insulating layers. The heat generated by the components is transmitted through thermal vias to the heat-dissipating insulating layer and then to the bottom aluminum substrate.
Application in center projector of AITO M9
The PCB applicated in central projection light engine used in AITO M9 is provided by us, including the production of the copper substrate PCB and SMT processing. This product uses a copper substrate with a thermoelectric separation technology, and the heat of the light source is directly transmitted to the substrate. In addition, we use vacuum reflow soldering for SMT, which allows the solder void rate to be controlled within 1%, thereby better solving the heat transfer of the LED and increasing the service life of the entire light source.
Application in super-power lamps
| Production item | Thermoelectric separation copper substrate |
| Material | Copper Substrate |
| Circuit Layer | 1-4L |
| Finish thickness | 1-4mm |
| Circuit copper thickness | 1-4OZ |
| Trace/space | 0.1/0.075mm |
| Power | 100-5000W |
| Application | Stagelamp, Photographic accessory, Field lights |
Flex-Rigid(Metal) application Case
The main applications and advantages of metal-based Flex-Rigid PCB
→ Used in automotive headlights, flashlight, optical projection…
→Without wiring harness and terminal connection, the structure can be simplified and the volume of the lamp body can be reduced
→The connection between the flexible PCB and the substrate is pressed and welded, which is stronger than the terminal connection
IGBT Normal Structure & IMS_Cu Structure
Advantages of IMS_Cu Structure Over DBC Ceramic Package:
➢ IMS_Cu PCB can be used for large-area arbitrary wiring, greatly reducing the number of bonding wire connections.
➢ Eliminated a DBC and copper-substrate welding process, reducing welding and assembly costs.
➢ IMS substrate is more suitable for high-density integrated surface mount power modules
Welded copper stripe on conventional FR4 PCB & Embedded copper substrate inside FR4 PCB
Advantages of Embedded Copper Substrate Inside Over Welded Copper Stripes On Surface:
➢ Using embedded copper technology ,the process of welding copper stripe is reduced, the mounting is simpler, and the efficiency is improved;
➢ Using embedded copper technology ,the heat dissipation of MOS is better solved;
➢ Greatly improve the current overload capacity, can do higher power for example 1000A or above.
Welded copper stripes on aluminum substrate surface & Embedded copper block inside single-sided copper substrate
Advantages of Embedded Copper Block Inside Over Welded Copper Stripes On Surface(For metal PCB):
➢ Using embedded copper technology ,the process of welding copper stripe is reduced, the mounting is simpler, and the efficiency is improved;
➢ Using embedded copper technology ,the heat dissipation of MOS is better solved;
➢ Greatly improve the current overload capacity, can do higher power for example 1000A or above.
Embedded ceramic substrate inside FR4
Advantages of Embedded Ceramic substrate:
➢ Can be single-sided, double-sided, multi-layer, and the LED drive and chips can be integrated.
➢ Aluminum nitride ceramics are suitable for semiconductors with higher voltage resistance and higher heat dissipation requirements.
Contact us:
Add: 4th Floor , Building A, 2nd West side of Xizheng, Shajiao Community, Humeng Town Dongguan city
Tel: 0769-84581370
Email: cliff.jiang@dgkangna.com
http://www.dgkangna.com
